微小化
微小化现今变得更加重要，特别是对于移动设备，物联网（IoT）和可穿戴电子产品。通过我们微小化解决方案，可以减小大多数电子系统尺寸以满足市场需求。
微小化技术带来的优点。
- 缩小产品XY尺寸提供更多的空间给电池有更多和整合更多的功能
- 减少零件高度(Z)和重量让产品更轻薄时尚
- 降地产品组装测试和包装的难度
- 提升讯号整合
- 可屏蔽电磁波的干扰
- 加速开发时程
- 较高的可靠度-抗潮湿和抗腐蚀性
- 更便于运输及库存管理
微小化
There are four key technologies about how to reduce XY Area.
- Use small foot print components: such as 01005 passive SMDs, fine pitch WLCSP, QFN IC package and reduce components space. This is "High Density SMT Technology”.
- Put components on both sides of substrate with special package architectures. This is "Dual Side Molding Technology”.
- Stack memory chips together on memory controller IC and wire bond together. This is "3D Stack Die Technology”.
- Bury SMDs or IC chips inside substrate layers can reduce XY Area also. This is "Embedded in Substrate Technology”.
High Density SMT
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High Density SMT
