Universal Scientific Industrial

微小化

微小化现今变得更加重要,特别是对于移动设备,物联网(IoT)和可穿戴电子产品。通过我们微小化解决方案,可以减小大多数电子系统尺寸以满足市场需求。

微小化技术带来的优点。

  • 降低材料成本
  • 可整合更多的功能
  • 更便于携带或运输
Universal Scientific Industrial

微小化

Encapsulation provides an economical way to protect device packages by isolating the active devices from environmental pollutants. At the same time, it offers mechanical protection by structural coupling of the device to the constituent packaging materials into a robust package. Transfer molding which includes selective molding and dual molding is normally used encapsulation.

Dual Side Molding

  • Universal Scientific Industrial

    Dual Side Mold with Filling Molding Via

  • Universal Scientific Industrial

    Dual Side Molding Exposed Ball

  • Universal Scientific Industrial

    Dual Side Mold with Substrate Interposer

Universal Scientific Industrial

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