Universal Scientific Industrial

微小化

微小化现今变得更加重要,特别是对于移动设备,物联网(IoT)和可穿戴电子产品。通过我们微小化解决方案,可以减小大多数电子系统尺寸以满足市场需求。

微小化技术带来的优点。

  • 降低材料成本
  • 可整合更多的功能
  • 更便于携带或运输
Universal Scientific Industrial

微小化

EMI Shielding is necessary for wireless SiP module applications. Conformal Shielding and Compartment Shielding can replace traditional metal lid and metal frame for EMI Shielding. Conformal Shielding (CFS) makes use of thin film metal sputtering on the SiP module’s top and edge surfaces to form EMI shielding. Compartment Shielding (CPS) uses conductive paste to fill in trench to isolate RF signal of each compartment of SiP module.

Universal Scientific Industrial

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