There are four key technologies about how to reduce XY Area.
- Use small foot print components: such as 01005 passive SMDs, fine pitch WLCSP, QFN IC package and reduce components space. This is "High Density SMT Technology”.
- Put components on both sides of substrate with special package architectures. This is "Dual Side Molding Technology”.
- Stack memory chips together on memory controller IC and wire bond together. This is "3D Stack Die Technology”.
- Bury SMDs or IC chips inside substrate layers can reduce XY Area also. This is "Embedded in Substrate Technology”.