Miniaturization becomes much more important, especially for mobile devices, Internet of Things (IoT) and wearable electronics. By integration of these miniaturization solutions, most electronic systems can reduce size to meet market requirements.
Miniaturization brings the following benefits.
- Lower material cost
- More integrated functions
- Easier for carry or transportation
EMI Shielding is necessary for wireless SiP module applications. Conformal Shielding and Compartment Shielding can replace traditional metal lid and metal frame for EMI Shielding. Conformal Shielding (CFS) makes use of thin film metal sputtering on the SiP module’s top and edge surfaces to form EMI shielding. Compartment Shielding (CPS) uses conductive paste to fill in trench to isolate RF signal of each compartment of SiP module.