Universal Scientific Industrial

IoT Solutions

IoT Solutions

Providing modules with various networking technologies (WiFi, BT, IoT, LoRa & WWAN), USI assists customers in obtaining effective solutions for IoT-related products and provides the overall D(MS)2 (Design & Manufacturing Services plus Miniaturization & Solutions) for customer. Our comprehensive design capability and advanced packaging technology allow us to be the best partner for your next generation products. Our home grown in-house capabilities include:

  • Design: Circuit Layout/Packaging Design/Electrical and Mechanical Simulation/Thermal Simulation/Debugging & Tuning/Antenna Simulation & Design
  • Manufacturing Technology: High Density SMT/Molding Encapsulation/Sputtering Conformal Shielding
  • Test & Qualification: Engineering Test/Qualification Test/Reliability Test/Manufacturing Test/Failure Analysis
  • Regulatory & compliance test: In-House Pre-Compliance/3rd Party Lab for UL/FCC, PTCRB/Field Test and Carrier Test
  • Advanced Packaging Technologies: Stacking, Double Side/Wafer Bumping/Embedded Passive/Active/Antenna Integration/Advanced Interconnection/Molding Under fill (MUF)
Universal Scientific Industrial

WWAN Modules

Working with top brand names in the M2M module industry, USI provides the D(MS)2 (Design & Manufacturing Services Plus Miniaturization & Solutions) on 3GPP based WWAN solutions and related integration. Our comprehensive design capability and advanced packaging technology allow us to be the best partner for your next generation products. Our home grown in-house capabilities include:

  • Design: Circuit Layout/Packaging Design/Electrical and Mechanical Simulation/Thermal Simulation/Debugging & Tuning
  • Manufacturing Technology: High Density SMT/Molding Encapsulation/Sputtering Conformal Shielding
  • Test & Qualification: Engineering Test/Qualification Test/Reliability Test/Manufacturing Test/Failure Analysis
  • Regulatory & compliance test: In-House Pre-Compliance/3rd Party Lab for UL/FCC, PTCRB/Field Test and Carrier Test
  • Advanced Packaging Technologies: Stacking, Double Side/Wafer Bumping/Embedded Passive/Active/Antenna Integration/Advanced Interconnection/Molding Under fill (MUF)

3G/LTE LTEPro/5G/LPWA

USI WWAN modules, 3G, LTE LTEPro, 5G and LPWA, have long history alone with 3GPP evolution. Our miniaturized design & advanced manufacturing process allow us to present the world smallest 3G data MODEM back in 2012. Our two-prong strategy guides our engineering efforts on both the high speed Cat16 LTE MODEM and the LPWA (Low Power Wide Area) products for machine-to-machine and IoT applications. We work together with world leading brands to realize small form factor LTE Cat-1, Cat-M, and NB-IoT modules.

  • UNA-A-01
    UNA-A-01
  • UNA-A-02
    UNA-A-02
Universal Scientific Industrial

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