Providing modules with various networking technologies (WiFi, BT, IoT, LoRa & WWAN), USI assists customers in obtaining effective solutions for IoT-related products and provides the overall D(MS)2 (Design & Manufacturing Services plus Miniaturization & Solutions) for customer. Our comprehensive design capability and advanced packaging technology allow us to be the best partner for your next generation products. Our home grown in-house capabilities include:
- Design: Circuit Layout/Packaging Design/Electrical and Mechanical Simulation/Thermal Simulation/Debugging & Tuning/Antenna Simulation & Design
- Manufacturing Technology: High Density SMT/Molding Encapsulation/Sputtering Conformal Shielding
- Test & Qualification: Engineering Test/Qualification Test/Reliability Test/Manufacturing Test/Failure Analysis
- Regulatory & compliance test: In-House Pre-Compliance/3rd Party Lab for UL/FCC, PTCRB/Field Test and Carrier Test
- Advanced Packaging Technologies: Stacking, Double Side/Wafer Bumping/Embedded Passive/Active/Antenna Integration/Advanced Interconnection/Molding Under fill (MUF)
IoT Modules
The Internet of things (IoT) is the inter-networking of physical devices, vehicles (also referred to as "connected devices" and "smart devices"), buildings, and other items embedded with electronics, software, sensors, actuators, and network connectivity which enable these objects to collect and exchange data.
AzureSphere Combo Module
AzureSphere combo module uniquely is designed for IoT applications, with multi-functionality design-in support by standard SDK, customer can easily migrate from discrete MCU solution to build their devices based on this module with secured connectivity to the cloud and shorten design cycle.
Azure Sphere combo module integrates MCU, SRAM, flash and supports all rates specified in IEEE 802.11 b/g/n and Bluetooth 5.0 with embedded secure OS to provide Microsoft patented high–level security in your networking. The module is embedded three customer-accessible, Cortex-A7, 1x CA7 and 2x CM4F with high-level user code, which offer WiFi, security supplicant, other network application hosted directly. There is an additional Cortex-M4 from the Bluetooth chipset as well.
- Smart Home Appliances
- Home Security and Safety
- Smart Energy
- M2M Business
- Cloud Computing
- Smart Manufacturing
- Fitness and e-Bike
Module Dimension: 28.0mm(L) x 28.0mm(W) x 2.2mm(H)
- Three cores : ARM Cortex-A7 runs up to 500MHz and two Cortex-M4F runs up to 200MHz
- 192kB TCM, 64kB SRAM, and integrated FPU; ideal for real-time control requirements
- 4MB embedded RAM among various cores
- 16MB Flash for the Azure Sphere operating system and user applications
- Two antenna: Dual band printed antenna design; External antenna for diversity or BLE
- Dual band 1T1R mode
- Bluetooth Core Specification 5.0
- Support for different interface options such as SPI/ I2S/ I2C/ UART/GPIOs and SPI
- Security support for WFA WPA/WPA2 personal
- Green design Compliance