Universal Scientific Industrial

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  • Press Releases
  •  05/02/2013

Exhibition at EXPO COMM WIRELESS JAPAN 2013


OVERVIEW
Universal Scientific Industrial (Shanghai) Co., Ltd. will conduct an exhibition at the Expo Comm Wireless Japan 2013, to be held at Tokyo Big Sight.
 

DETAIL

EXPO COMM WIRELESS JAPAN 2013.

Period

May 29 (Wednesday) to 31 (Friday)

Location

Tokyo Big Sight Hall 4  (Address : 3-11-1 Ariake, Koto-ku, Tokyo)

URL

http://www.wjexpo.com/

Online registration

https://expo.ric.co.jp/wj2013/jizen/

Booth No.

WT-4


SUMMARY
USI is going to introducing wireless connectivity solution for various kinds of products and enterprise.


DEMONSTRATION

Wireless Connectivity Solution

  • WICED Module: (WiFi) Broadcom 43362+ (MCU) STM32F205
  • WiGig (60GHz) Module: Wilocity WIL6110/6120 + Qualcomm AR9462
  • 802.11 ac/a/b/g/n Module : Broadcom 4335
  • NFC Module: NXP PN544
  • 4-In-1 Module : Broadcom 43341
     

Enterprise Wi-Fi AP/Router

  • BCM Northstar 3x3 802.11ac Dual Band AP/Router
  • QCA Scorpion 3x3 802.11ac Dual Band AP/Router
  • Freescale P1 3x3 802.11ac Dual Band AP/Router
     

Enterprise Wi-Fi Module

  • Broadcom 43431 3x3 802.11a/b/g/n Dual Band High Power Module
  • Broadcom 43460 3x3 802.11a/b/g/n/ac Dual Band High Power Module
  • QualcommAtheros 9590 3x3 802.11a/b/g/n Dual Band High Power Module
  • QualcommAtheros 9880 3x3 802.11a/b/g/n/ac Dual Band High Power Module
Universal Scientific Industrial

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