Universal Scientific Industrial

IoT Solutions

IoT Solutions

Providing modules with various networking technologies (WiFi, BT, IoT, LoRa & WWAN), USI assists customers in obtaining effective solutions for IoT-related products and provides the overall D(MS)2 (Design & Manufacturing Services plus Miniaturization & Solutions) for customer. Our comprehensive design capability and advanced packaging technology allow us to be the best partner for your next generation products. Our home grown in-house capabilities include:

  • Design: Circuit Layout/Packaging Design/Electrical and Mechanical Simulation/Thermal Simulation/Debugging & Tuning/Antenna Simulation & Design
  • Manufacturing Technology: High Density SMT/Molding Encapsulation/Sputtering Conformal Shielding
  • Test & Qualification: Engineering Test/Qualification Test/Reliability Test/Manufacturing Test/Failure Analysis
  • Regulatory & compliance test: In-House Pre-Compliance/3rd Party Lab for UL/FCC, PTCRB/Field Test and Carrier Test
  • Advanced Packaging Technologies: Stacking, Double Side/Wafer Bumping/Embedded Passive/Active/Antenna Integration/Advanced Interconnection/Molding Under fill (MUF)
Universal Scientific Industrial

System On Module (SOM)

USI R&D team utilizes its leading technology in the wireless communications module market and announces its WiFi and WWAN SOM (System on Module) IoT module with NXP and Qualcomm solutions to provide customers with a variety of solutions for Internet of Things scenario.

In terms of product requirements, customers not only look for a miniaturization and robust design but also desire the development time can be shortened and more comprehensive. Our SOM IoT module adopts Qualcomm Snapdragon SDM660/SDA660 and NXP i.MX serial, by integrating a majority of the system functions and also including the application processor, memory, power processing chip, and related wireless transmission functions. The SOM IoT module can provide different choices on specific product applications, such as Rugged Handheld, Mobile POS, Rugged Tablet, Wearable Device, and Car Terminal.

MS-03 PRO

Description

The MS-03 PRO is a highly integrated System On Module (SOM) which integrates a system features with Qualcomm SDM450 Processor, Memory, PMIC, Audio CODEC and multiple mode wireless connectivity. MS-03 PRO provides WiFi 11 a/b/g/n/ac and BT4.2 wireless function; MS-03 PRO is a multi-band Wireless WAN module with LTE-FDD/TDD, WCDMA, GSM and GNSS features.
 
Applications
  • Mobile POS
  • Rugged Handheld Device
  • Rugged Tablet
  • Home Security Panel
Features
  • Qualcomm SDM450 1.8GHz Application Processor
  • LPDDR3 SDRAM, eMMC5.1 Flash Memory
  • WiFi 802.11a/b/g/n/ac, BT4.2
  • LTE-FDD/TDD, WCDMA, GSM
  • GPS/GLONASS/BeiDou/Galileo
  • 4-lane MIPI DSI Display Interface
  • 4-Lane MIPI CSI Camera Interface
  • Passed Qualcomm PDN Simulation
  • Miniaturization by High Density SMT
  • Robust design for Industry Applications
 
SOM Modules List

Universal Scientific Industrial

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