Optical Transceiver
Optical Transceiver
USI has industry-leading capabilities in high-speed signal integrity and power integrity (SI/PI) design, as well as advanced thermal simulation and optical simulation using Zemax. In addition, we have strong expertise in high-speed PCB design utilizing mSAP and substrate PCB technologies. USI also operates dedicated optical communication laboratories for module performance verification, including optical eye diagram measurements using high-speed sampling scopes and bit error rate testing using BERT equipment.
Beyond R&D strengths, USI’s manufacturing capabilities for optical modules include high-density SMT processes, KGD flip-chip, and die/wire bonding production lines with full testing and validation. The company also supports optical device assembly along with optical module testing capabilities. These end-to-end capabilities enable USI to deliver complete solutions from design and development to high-volume manufacturing.
Beyond R&D strengths, USI’s manufacturing capabilities for optical modules include high-density SMT processes, KGD flip-chip, and die/wire bonding production lines with full testing and validation. The company also supports optical device assembly along with optical module testing capabilities. These end-to-end capabilities enable USI to deliver complete solutions from design and development to high-volume manufacturing.
Optical Engine and Component
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Through collaboration across the industry value chain, USI and EugenLight Technologies are building end-to-end capabilities in optical communications from design to mass production. EugenLight specializes in high-speed optoelectronic components and optical engines and is a pioneer in silicon photonics integration.
EugenLight’s technologies support applications such as space optical communications, LiDAR, and photonic computing. Its team will work with USI to grow the optical interconnect business and establish a global brand in optoelectronic applications.
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