Universal Scientific Industrial

USI Blog

Top trending topic for the latest innovation technology, application and industry insight.
Back

Search

  •  03/25/2025

Breaking the Bottleneck: The emergence of 3D packaging power modules


Following up on the previous discussion on "The Dual Challenges of High-Performance Computing Systems," this article extends the discussion to potential solutions. To address challenges such as power consumption and heat dissipation, USI is implementing "3D packaging" technology for power modules. This approach enables compact integration of power modules within systems, enhancing power density and energy efficiency.
 

 
Furthermore, 3D packaging facilitates optimized thermal design, reducing system temperature and improving overall stability and reliability. Compared to traditional centralized packaging solutions, transitioning power modules to 3D packaging offers several key advantages:
  1. Increased Power and Current Density: It allows for the integration of more components within a limited space, significantly boosting power and current density. This is particularly crucial for HPC systems requiring high performance and power output.
  2. Improved Thermal Performance: It enables more effective heat management through flexible thermal design and efficient heat dissipation pathways. This helps reduce module operating temperatures, prolong component lifespan, and enhance system reliability.
  3. Reduced Electromagnetic Interference (EMI): It allows for better shielding and isolation of sensitive components, thereby minimizing EMI. This is essential for maintaining the stability and performance of HPC systems.
  4. Enhanced Manufacturing Efficiency: It facilitates automated production processes, which not only improves manufacturing efficiency but also reduces production costs. Automation also ensures product consistency and quality.
  5. Support for High-Frequency Operation: It allows for the use of advanced materials and designs to support higher switching frequencies. This contributes to improved power module efficiency, reduced power consumption, and support for more efficient computing.
  6. Flexible Design and Integration: It enables more flexible design and integration, allowing for customization based on specific application requirements. This is highly beneficial for HPC systems requiring specific performance characteristics and functionalities.

For a more comprehensive understanding of the key technologies and processes, including USI's manufacturing capabilities, please refer to the video below:
USI Capability | Power Module MFG Process for AI Server


Wide Applications and Driving Forces of High-Performance Computing

High-Performance Computing (HPC) has permeated various aspects of our lives, becoming a crucial engine driving technological advancement. From fundamental scientific research to industrial production, its presence is ubiquitous.

In scientific research, for instance, the initial attempt to sequence the human genome took 13 years; today, HPC systems can accomplish this task in less than a day. In weather forecasting, processing massive amounts of historical meteorological data and climate-related data points has improved the accuracy and timeliness of forecasts. In simulations, HPC is used to create simulation models, such as car crash test simulations, enabling rapid and efficient testing in virtual environments, saving both time and cost.

The driving forces behind HPC development primarily stem from three key areas:
  • The Advent of the Big Data Era: The explosive growth of data has led to a surge in demand for data processing capabilities. HPC provides powerful computing resources for analyzing and mining massive datasets.
  • The Rise of Artificial Intelligence: Artificial intelligence, particularly deep learning, requires substantial computational resources for model training. HPC provides a solid foundation for AI development.
  • Industrial Transformation and Upgrading: With the development of Industry 4.0, traditional industries such as manufacturing, energy, and finance are undergoing intelligent transformation, and HPC is a key technology for achieving this transformation.
In summary, 3D power modules play a significant role in enhancing HPC system capabilities. They not only improve system computing speed and data processing capacity but also reduce energy costs, driving progress in scientific research and engineering design. As a key force driving AI technological advancement, HPC development is full of both challenges and opportunities.

USI competes in the market with 3D packaging technology as its core, and our greatest advantage is our flexibility in providing customers with the customized packaging solutions they need. In the future, with continuous breakthroughs in related technologies, HPC will play a more significant role in more fields. Its importance as a crucial guarantee for today's high-tech production and services is self-evident.
 

Search

Recent Articles

Universal Scientific Industrial
Universal Scientific Industrial

Please enter key words

Tell USI what you think

Would you please take a minute to send USI your feedback?
Your feedback is anonymous.

Yes
No
Subscribe USI

Stay tuned on our Blog for the latest innovative
technology, application, and industry insight.

Go subscribe
Already subscribed
Universal Scientific Industrial
Forgot Account ID?

Please send email to service@usiglobal.com for further assistance.

Please scan this QR Code via WeChat and share it.

The website uses cookies to ensure you get the best experience on our website. By using our website, you consent to our Cookie Term.