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  •  06/28/2022

Getting more in less with SiP Ep.1: Global Trends & Market Demands


You may have heard dozen times that "Miniaturization will change the world. " But why and how? Seventy years ago, the primary computer was built, occupying a place of 1800 sq. ft. and weighing over 27 tons. Today, engineers put all the effort into developing mobile devices with even more computing and data processing capabilities. How do engineers make it happen? The answer comes with "Miniaturization".

Growing Demand for Miniaturization of Electronic

Miniaturization in electronic devices is literally fitting more transistors on a smaller integrated circuit (IC). The IC is then assembled and interfaced with other components, forming a system or subsystem to perform the preferred function. What the technology can make is even tinier but mightier. How to realize miniaturization and to accommodate all these processors and components made with different technology and material in such limited space, System-in-Package (SiP) was born to respond. 

A package containing more than just a single chip, often plus passive components, is considered a System-in-Package (SiP). In short, multiple chips can be assembled in a package along with different types of components and stacked together to constitute a more complex and complete system.

Being identified by many leading companies, SiP presents several advantages such as form factor reduction, performance enhancement, functional integration with EMI isolation, design flexibility compared to mounting standalone components on a system PCB, etc.


Increasing Market of System-in-Package (SiP) 

The scope of System in Package (SiP) is estimated to boost from $14 billion in 2020 to more than $19 billion by 2026. The forecasts by Yole Développement show that the high-end SiP market will increase at a CAGR of 9% between 2020 and 2026, while the low-end Radio Frequency SiP market for smartphones and mobile applications will grow at a CAGR of slightly less than 5% during the same period.

When you look over the entire market trend, you will find out that 5G topics became a hit in these few years and will keep that way undoubtedly. The Rising of advanced 5G infrastructure will enhance the market growth due to the usage of Radio Frequency components. For the next few decades, no doubt that wearables and IoT will show significant growth in the SiP market, with the main drivers being sensors and advanced wireless communication technologies like 5G and beyond. Despite the saturation of smartphones. There are new opportunities for SiP adoption due to the demand of 5G and new wireless technologies.

To prevent the wireless networks from suffering from numerous traffic jams soon due to the massive devices worldwide, 5G devices that support high bandwidth and massive communications become a top solution. The SiP technology would accelerate the transition to 5G from the 4G technology. The data rates supported by 5G technology will be much faster than the currently available technologies.

Learn more: USI Advanced 5G Turnkey Services & Two Challenges You Need to Overcome When Developing 5G Products

The main drivers of automotive and transportation development are ADAS and infotainment. ADAS and infotainment systems require computer power where better performance between processor and memory can be achieved by SiP. SiP is also seen in MEMS and sensors, including pressure, IMU, optical, microbolometer, oscillator, and environmental sensors applications. For other markets, such as medical, industrial, defense, and aerospace, SiP shapes in much smaller sizes, while the market growth in robotics and IoT-related applications is quite strong.


Through SiP tech, USI can do more

The benefits of miniaturization are vast and never-ending. At USI, our strength in SiP lies in product development for modules and system devices. From efficient designs to manufacturing, we offer customers a total SiP solution for miniaturized products.

Benefits of adopting SiP technology 
  • Optimized Size (XY) to have more Space for Battery and new functions
  • Reduced Thickness (Z) and Weight for Stylish Design
  • Enhance Reliability - Humidity and Mechanical
  • Robust EMI Shielding
  • Simplified Board and System Assembly 
  • Better Signal Performance
  • Fast Product Development
  • Streamlined Logistics and Inventory Management

More and more brilliant solutions can be realized for humankind via SiP technology. USI has leveraged immense engineering expertise and experiences, devoting ourselves to SiP production and assisting our customers in bringing the solution to life.

 

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